INTERpack'97 - Integration Session Call for Papers

Call For Papers - Technical Session

Innovations in Integrated CAD/CAE for Electronic Packaging

INTERpack'97
Kohala Coast, Island of Hawaii, USA
June 15-19, 1997

Sponsored by ASME International
Invited Participating Societies include:
JSME, IEEE, IEPS, ISHM, SPE, OSA, MRS, JWS,
JIIPEC, IEICE, SHM, JSCM, JSSFM, JSNI, SAEJ, SNAJ

Conference Background

Building on the success of INTERpack '95, INTERpack'97 is the key intersociety conference for electronic & photonic packaging researchers, designers, managers, and educators, with over 500 participants expected. Further conference and session information is available at http://eislab.gatech.edu/events/interpack97/.

Session Emphasis

With a focus on applications to electronic packaging design, this session invites papers and extended abstracts on innovative CAD/CAE integration techniques and experiences. Topics sought from product designers & analysts and CAD/E tool developers & researchers include:

Design case studies involving multi-tool, multi-level, multi-disciplinary analysis (including thermomechanical, EMI, and thermal behavior of components, MCMs, PWAs, and systems)
Overviews of integrated CAD/E tools (commercial, in-house, prototype)
Techniques for design-analysis integration and multidisciplinary optimization
Design for Manufacturing/Performance/Reliability tools involving analysis of physical behavior
Experiences with integrated toolsets and data exchange standards (e.g., STEP, EDIF, IPC)
Critical reviews, design analysis methodologies, and needs assessments

Prospective authors must submit a 200-word abstract by Sept. 10, 1996 to the Session Chair or Co-Chair (email is prefered).

Critical Dates

September 10, 1996 - 200 Word Abstracts Due
September 30, 1996 - Authors to be notified of abstract acceptance
November 29, 1996 - Full length paper or an extended abstract due
December 31, 1996 - Authors notified of paper (extended abstract) acceptance
February 29, 1997 - Final manuscripts due

Session Chair/Co-Chair

Prof. Robert E. Fulton
Georgia Institute of Technology
School of Mechanical Engineering
813 Ferst Drive, MARC 451
Atlanta, Georgia 30332-0405 USA
+1-404-894-7409
+1-404-894-9342 fax
robert.fulton@me.gatech.edu

Dr. Russell S. Peak
Georgia Institute of Technology
Engineering Information Systems Lab
813 Ferst Drive, MARC 459
Atlanta, Georgia 30332-0560 USA
+1-404-894-7572
+1-404-894-9342 fax
peak@cad.gatech.edu