PTH IPC-D-279 Analysis Form

This form gathers product and process data for a PTH stress analysis based on the formulas provided by the Institute for Interconnecting and Packaging Electronic Circuits in IPC-D-279, "Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies". For a detailed explanation of this model, please refer to the U-Engineer implementation of IPC-D-279 PTH analysis documentation.

Press 'Process' in the other frame to generate the form and automatically populate the geometric fields with appropriate values from the GenX file.