CAD-Based Analysis Tools for Electronic Packaging Design (A New Modeling Methodology for a Virtual Development Environment)
Zhou, W. X.; Hsiung, C. H.; Fulton, R. E.; Yin, X. F.; Yeh, C. P.; Wyatt, K. (1997) Advances in Electronic Packaging-1997, EEP-Vol. 19-1, Suhir, E., et al., eds., InterPACK'97, June 15-19, 1997, Kohala Coast, Hawaii, 971-979.
An integrated Finite Element Modeling (FEM) Methodology has been addressed for concurrent mechanical design of electronic products.
The new modeling methodology (MPI/FEM) consist three core modeling approaches: Modularized FEM (M/FEM), Parametric FEM (P/FEM), and Interactive FEM (I/FEM).
These approaches have been investigated, and then integrated into conventional FEM code. A component FE model library can be easily created
by modularized modeling concept. The main idea of parametric modeling is to create, or define, a FE model template, instead of a detailed FE model, by
parameters and their forming rules. The Interactive FEM approach allows the designers to analyze and visualize design models interactively. A FE model created
by these approaches has the advantages of flexibility, compatibility and portability. A multi-level solution approach is applied to produce solution results.
From the study results, it has been concluded that the developed methodology is a vital tool for thermomechanical design, and can be applied to the development of a virtual
design environment for electronic products.