Parameter Design of Heat Sink: Multiple Trade-offs Reference Cimtalay, S. and Fulton, R.E., Parameter Design of Heat Sink: Multiple Trade Offs.,Proceedings of ASME Winter Annual Meeting, Volume EEP-9, pp. 53-58, November 10, 1994, Chicago, Illinois. Keywords multiobjective optimization, trade-offs, heat-sink Abstract This paper is to develop a mathematical model, to optimize and to evaluate a heat sink on chip in Electronic Printed Board Assembly. The model emphasizes Thermo-Mechanical Behavior considering cost, heat and geometrical aspects. An optimization model has been developed that characterizes a heat sink at the parameter design stage. The model, which is a multi objective multi constraint nature, is formulated as a Compromise DSP format. A group of scenarios in one or two priority levels of the goals has been investigated Documents Manuscript: pdf