An Investigation of PWB Layout by Genetic Algorithms to Maximize Fatigue Life Reference Scholand, A.J.; Bras, B. (1994) An Investigation of PWA Layout by Generic Algorithms to Maximize Fatigue Life, ASME Winter Annual Meeting, Proceedings of ASME Winter Annual Meeting, Volume EEP-9, Chicago, 43-52. Abstract Thermal considerations in Printed Wiring Board (PWB) assemblies are becoming increasingly important as packaging constraints shrink and power use escalates. In this paper, we provide a study on the potential for a Genetic Algorithm-driven PWB layout design tool to improve the thermal performance of such assemblies. As a case study, the thermo-mechanical fatigue of surface mounted leadless chip carriers on an FR4 epoxy board is used. We have found that by utilizing appropriate formula-based engineering approximations, the efficiency of Genetic Algorithms in finding near-optimal and optimal results makes this approach effective as an explorative 'scouting' approach to identify promising board configurations for more computationally expensive evaluations such as finite element method. Documents Manuscript: pdf