Optimization of Solder Joint Fatigue Life Using Product Model-Based Analysis ModelsReferenceCimtalay, S.; Peak, R. S.; Fulton, R. E. (1996) Optimization of Solder Joint Fatigue Life Using Product Model-Based Analysis Models. Application of CAE/CAD to Electronic Systems, EEP-Vol.18, Agonafar, D., et al., eds., 1996 ASME Intl. Mech. Engr. Congress & Expo., Atlanta, 47-53. Keywordsoptimization, product model, analysis, solder joint fatigue AbstractProduct Model-Based Analysis Models (PBAMs) have been presented
as highly automated analysis modules for designer usage. Previous
examples such as solder joint fatigue PBAMs have shown how explicit
design-analysis associativity linkages enable seamless interfaces
to solution tools (e.g., finite element analysis systems). These
examples focused on using PBAMs for design verification, where
a criteria such as fatigue life was checked given one design state
as an input. Documents |