Correlation of Analytical and Experimental Approaches to Determine Thermally Induced PWB Warpage Reference Yeh, C.P.; Ume, C.; Fulton, R.E.; Wyatt, K.; Stafford, J. (1991) IEEE Transactions on Components. Hybrids and Manufacturing Technology, Vol. 16, No. 8, 986-995. Keywords Printed circuit boards, Finite element method, Electric connectors, Thermal effects, Thermomechanical properties, Shadow Moire method Abstract Thermomechanical design effects in the printed wiring board (PWB) design process are becoming increasingly important due to ever- stringent electronic product requirements. In the past few years, the finite element method (FEM) has become a vital and effective design vehicle to many facets of the PWB design process. Despite its increasing popularity in PWB design, the FEM has seldom been validated for its appropriateness and accuracy in modeling PWB thermomechanical behavior. We have conducted a research project in developing advanced FEM-oriented capabilities to simulate thermally induced PWB warpage. The FE analysis results are validated by correlating them with measurements obtained from a separate experimental approach using the shadow Moire method.