Modularized & Parametric Modeling Methodology for Concurrent Mechanical Design of Electronic Packaging Reference Zhou, Wen X. (1997), Modularized & Parametric Modeling Methodology for Concurrent Mechanical Design of Electronic Packaging , Doctoral Thesis, Georgia Institute of Technology, Atlanta. Abstract Based on the observation that there are limited components used to fabricate a product, and limited types of interconnections in a component assembly, a novel approach, so called Modularized & Parametric Finite Element Modeling methodology, has been developed to provide a promising capability for analyzing an entire featured electronic product in much less time without loss of accuracy. Several disciplinary techniques and algorithms have been investigated, and then integrated into a conventional Finite Element Method (FEM) code. Electrical components are classified into a limited number of categories by taxonomic technique. These components are further decomposed into Modularized Geometry Primitives (MGPs). MGPs are used as the most basic building blocks for a product model assembly. Each MGP is created by using a parametric modeling approach. The parametric modeling approach is to create or define a model template by parameters and its forming rules, instead of a specific model. The template is used to generate an actual analysis model by populating data into the parameters of a template. A template serves as a master model mock-up, and is applied for one-to-many modeling activities. A graph tree so called Constructive Module Assembly Tree (CMAT), is developed to represent the relations of MGPs and the product assembly. A few graph algorithms are developed to assemble a FE model for the product by using CMAT. A divide-and-conquer algorithm is developed to model a multi-layer PWB substrate with copper traces. This algorithm partitions the board into small sections, such that each section can be individually modeled and assembled back to represent the original board. Two case studies have been performed to test the capability and flexibility of the developed methodology. From the study results, it has been concluded that the developed methodology is a very cost-effective and vital tool for thermomechanical design of an electronic product. Given the challenge to improve product quality and reliability, while decreasing product cost and "time-to-market", an approach, identifying the key characteristics that can contribute to thermal and/or mechanical failure, has been pursued. Documents Manuscript: pdf (10,745KB)