Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study

11/19/97


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Table of Contents

Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study

Context- Goal Statement

Context Analogy

Context Analogy

Illustrative Examples

PWB Case Study

Product & Process Analysis

Mfg. Knowledge Capture

Ease of Use

Capture Analysis Assumptions

Product-Specific Information

PWB+Process Information

Analysis Information Needs

Analysis Information Needs

Importance of Material Models

Thermal Loading Model

Mechanical Response Model

Mechanical Response Model

PWB Case Study Results

PWB Case Study Results

Future Work

Future Work

End Slide

Author: Andrew J. Scholand

Email: andrew.scholand@cad.gatech.edu

Home Page: http://eislab.gatech.edu/

Other information:
Presented at the 1997 ASME International Mechanical Engineering Congress and Exposition