Slide 11 of 26
Notes:
- Four different analysis modules were supported in the TIGER scenario:
- PWB Warpage
- Solder Joint Deformation
- PWA Warpage
- PTH Deformation
- The analysis modules themselves and the theory behind them will not be discussed in this presentation.
- For out purposes, the analysis modules may be viewed as “black boxes”, which consume information and employ some solution method to obtain analysis results.
- The table shown in this slide shows the product information required by each of these analysis modules.
- As we can see in the PWB Warpage Module, this information depends on the solution method employed (e.g., formula-based vs. finite-element).
- Two important points about this table should be emphasized:
- First, some product information is used by more than one analysis module (e.g., the detailed PWB layup is used by all analysis modules).
- Second, the information requirements of a given analysis module may span more than one repository (e.g., the solder joint deformation analysis requires data about the detailed layup of the PWB (which is stored in one file) and the package geometry of the components (which is stored in a different file).
- In the next slides I will explain how these two issues are addressed by the technique presented in this paper.
