Solder Joint Deformation Case Study #3
Plane Strain Model (PBAM type 3)
SMD 1206 resistor
Thermal cycling load
Detailed solder joint geometry
shear stress, txy (ANSYS)
deformation, u (CADAS)
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Contents
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Background
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MRA Overview
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Examples
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Methodology
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Summary
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References
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[
MRA Overview
:
SMMs
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ABBs
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PMs
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PBAMs
]
