Slide 8 of 26
Notes:
- As these layup details affect PWB thermomechanical behavior, the PWB manufacturer runs some analyses to check the impact of his decisions.
- He invokes the Warpage Analysis Application to assess the warpage undergone by the board due to changes in temperature that occur during manufacturing.
- Two levels of warpage analysis detail can be requested: a quick formula-based warpage analysis and an FEA-based plane strain warpage analysis.
- The PWB manufacturer performs this design-analysis iteration until he is satisfied with the layup.
- Other analyses modules offered by DaiTools are a PWA deformation analysis (to asses the warpage of the board with the components on it), a solder-joint deformation and fatigue analysis (to assess joint deformation and fatigue life due to temperature changes on a component basis), and a plated-through hole deformation module (to assess deformation inside plated-through holes due to changes in temperature).
