PWB Layup Design and Analysis Cycle

PWB Layup

Design Tool

Analyzable Product Database

Quick

Formula-based check

Accurate FEM check

Thermal Bending Model

Plain Strain Model

Layup

Redesign

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• As these layup details affect PWB thermomechanical behavior, the PWB manufacturer runs some analyses to check the impact of his decisions.

• He invokes the Warpage Analysis Application to assess the warpage undergone by the board due to changes in temperature that occur during manufacturing.

• Two levels of warpage analysis detail can be requested: a quick formula-based warpage analysis and an FEA-based plane strain warpage analysis.

• The PWB manufacturer performs this design-analysis iteration until he is satisfied with the layup.

• Other analyses modules offered by DaiTools are a PWA deformation analysis (to asses the warpage of the board with the components on it), a solder-joint deformation and fatigue analysis (to assess joint deformation and fatigue life due to temperature changes on a component basis), and a plated-through hole deformation module (to assess deformation inside plated-through holes due to changes in temperature).