TIGER APM

capacitor

resistor

surface mount

package

discrete

component

integrated

component

pwb copper

foil

plated through

passage

through-hole

package

location

electrical

component

assembly

pwa

part

pwb

feature

component

occurrence

solid

material

pwb copper

cladded laminate

pwb prepreg

set

electrical

package

pwb

pwb

layer

pwb

passage

linear elastic

model

solder

joint

leads

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• As I showed you before shown in the TIGER data flow diagram, the APM population technique described above was applied to the TIGER project.

• For this, a new APM - the “TIGER APM” - was developed for the project.

• The development of the TIGER APM was driven by the information requirements of the analysis modules that I showed you before in the table of information requirements.

• This slide shows a high-level EXPRESS schema of the TIGER APM, which provides a single source for the following information about the product:
  • PWB information: the outline of the PWB, its thickness and detailed layup (including thicknesses and materials of each layer that makes up the board).
  • Electrical components: their location on the board, packaging (geometry and material), leads and solder joints (geometry and material).
  • Plated-though holes and vias: geometry, location, and plating materials.
  • PWB layup materials: nominal thicknesses and material properties (such as coefficients of thermal expansion, Young’s Modulus, etc.) for commercial copper foils, copper-cladded laminates and prepreg sheets that make up the PWB.