Slide 16 of 26
Notes:
- As I showed you before shown in the TIGER data flow diagram, the APM population technique described above was applied to the TIGER project.
- For this, a new APM - the “TIGER APM” - was developed for the project.
- The development of the TIGER APM was driven by the information requirements of the analysis modules that I showed you before in the table of information requirements.
- This slide shows a high-level EXPRESS schema of the TIGER APM, which provides a single source for the following information about the product:
- PWB information: the outline of the PWB, its thickness and detailed layup (including thicknesses and materials of each layer that makes up the board).
- Electrical components: their location on the board, packaging (geometry and material), leads and solder joints (geometry and material).
- Plated-though holes and vias: geometry, location, and plating materials.
- PWB layup materials: nominal thicknesses and material properties (such as coefficients of thermal expansion, Young’s Modulus, etc.) for commercial copper foils, copper-cladded laminates and prepreg sheets that make up the PWB.
