EIS Lab homeResearch Snapshots, Accolades, ...Faculty, Staff, Students, and AlumniPapers, Reports, Theses, ...Analysis Theory & Methodology, X-Analysis Integration (XAI), Change Management, Engineering Information Technology, ... Projects, Sponsors, Toolkits, ...Conferences, Workshops, Thesis Presentations, ... Georgia Tech search engineCourses, Tools, Related Organizations, Directions & Locale Guides, ...

CAD-Based Analysis Tools for Electronic Packaging Design (A New Modeling Methodology for a Virtual Development Environment)


Zhou, W. X.; Hsiung, C. H.; Fulton, R. E.; Yin, X. F.; Yeh, C. P.; Wyatt, K. (1997) Advances in Electronic Packaging-1997, EEP-Vol. 19-1, Suhir, E., et al., eds., InterPACK'97, June 15-19, 1997, Kohala Coast, Hawaii, 971-979.


An integrated Finite Element Modeling (FEM) Methodology has been addressed for concurrent mechanical design of electronic products. The new modeling methodology (MPI/FEM) consist three core modeling approaches: Modularized FEM (M/FEM), Parametric FEM (P/FEM), and Interactive FEM (I/FEM). These approaches have been investigated, and then integrated into conventional FEM code. A component FE model library can be easily created by modularized modeling concept. The main idea of parametric modeling is to create, or define, a FE model template, instead of a detailed FE model, by parameters and their forming rules. The Interactive FEM approach allows the designers to analyze and visualize design models interactively. A FE model created by these approaches has the advantages of flexibility, compatibility and portability. A multi-level solution approach is applied to produce solution results. From the study results, it has been concluded that the developed methodology is a vital tool for thermomechanical design, and can be applied to the development of a virtual design environment for electronic products.


Manuscript: pdf(554KB)