Automating Routine Analysis in Electronic Packaging Using PBAMs, Part I: PBAM Overview Reference Peak, R. S.; Fulton, R. E. (1993) Automating Routine Analysis in Electronic Packaging Using Product Model-Based Analytical Models (PBAMs), Part I: PBAM Overview. Paper 93-WA/EEP-23, ASME Winter Annual Meeting, New Orleans. Abstract Previous work introduced a new representation of engineering analysis models, termed product model-based analytical models (PBAMs) [Peak and Fulton, 1992b]. Since analysis information is linked with detailed design information, PBAMs enable rapid, flexible analysis in support of product design. In this approach, a catalog of ready-to-use PBAMs can be created that automate established, "routine" analysis models. This document, Part I of two companion papers, discusses the use of PBAMs in routine analysis and overviews the PBAM representation. Part II describes PBAMs of representative solder joint fatigue models that illustrate and evaluate the PBAM representation. Combined, these papers emphasize how PBAMs can automate the interaction of heterogeneous analysis models. A new notation, constraint schematics, is included in this paper that graphically represents analysis models. Since PBAMs are founded upon constraint graph theory and object-oriented information modeling concepts, a high degree of flexibility and modularity is achieved. Documents Manuscript: pdf(231 KB)