Automating Routine Analysis in Electronic Packaging Using PBAMs, Part II: Solder Joint Fatigue Case Studies Reference Peak, R. S.; Fulton, R. E. (1993) Automating Routine Analysis in Electronic Packaging Using Product Model-Based Analytical Models (PBAMs), Part II: Solder Joint Fatigue Case Studies. Paper 93-WA/EEP-24, ASME Winter Annual Meeting, New Orleans. Abstract A new representation of engineering analysis models, termed product model-based analytical models (PBAMs) was introduced previously [Peak and Fulton, 1992b]. Since PBAMs link analysis information with detailed design information, they enable rapid, flexible analysis in support of product design. This document, Part II of two companion papers, describes PBAMs of representative solder joint fatigue models that illustrate and evaluate the PBAM representation. Part I overviews the PBAM representation and defines the constraint schematic notation used in this paper. Results show that PBAMs provide rapid analysis results from mixed formula-based and finite element-based analysis models. In some cases different input/output combinations can be run; hence, both design analysis and limited design synthesis can be supported by the same PBAM. Documents Manuscript:pdf (373KB)