XAI Research & Development - Suggested Starting Points
The following list is a suggested sequence to learn more about
our X-analysis integration (XAI) research and
design-analysis integration (DAI) research. Many of the
publications are accessible online by following the web links. The sequence starts
with user-oriented views and proceeds to the underlying techniques and further
Further references are given in
A DAI Glossary is also available.
X-Analysis Integration / Multi-Representation Architecture (XAI/MRA) Research Overview.
Brief description with annotated bibliography. Presentation-style overviews.
NIST Board Warpage,
D Zwemer, M Bajaj, RS Peak, TR Thurman, K Brady, S McCarron, A Spradling, M Dickerson, L Klein, G Liutkus, J Messina (2004)
PWB Warpage Analysis and Verification Using an AP210 Standards-based
Engineering Framework and Shadow Moiré,
IEEE EuroSimE Conference, Brussels.
RS Peak, R Matsuki, MW Wilson,
D Koo, AJ Scholand, Y Hatcho, S Zeng (2001)
Object-Oriented Internet-based Framework for Chip Package Thermal and Stress
Simulation. InterPACK'01, Hawaii.
Overviews MRA-based automation of thermal resistance analysis for electronic packages, including product-data driven variable topology FEA solutions.
R. S. Peak, A. J. Scholand, R. E. Fulton, D. Koo, D. R. Tamburini, M. W. Wilson, S. Zeng, J. H. Roberts, P. J. Spann (Aug 23, 1999c) Product Data-Driven Analysis in a Missile Supply Chain (ProAM) Final Report, Georgia Tech Engineering Information Systems Lab Technical Report E-15-642-D05, Concurrent Technologies Corp Contract N00140-96-D-1818/0008 for US DoD JECPO.
Describes tools and techniques developed in the ProAM project. Techniques cover general analysis integration and Internet-based engineering service bureau (ESB) concepts. PWA/B applications include the XaiTools™ toolkit and U-Engineer.com.
R. S. Peak, R. E. Fulton, A. Chandrasekhar, S. Cimtalay, M. A. Hale, D. Koo, L. Ma, A. J. Scholand, D. R. Tamburini, M. W. Wilson
(Feb. 2, 1999) Design-Analysis Associativity Technology for PSI, Phase I Report: Pilot Demonstration of STEP-based Stress Templates
Georgia Tech Project E15-647, The Boeing Company Contract W309702.
Overviews MRA applications relevant to integration of aerospace structural analysis.
Includes CBAM concepts, APM links to CATIA CAD models, and XaiTools usage of Mathematica
as a COB-based constraint solver.
Peak, R. S.; Fulton, R. E.; Sitaraman, S. K. (1997)
Thermomechanical CAD/CAE Integration in the TIGER PWA Toolset.
InterPACK'97, June 15-19, 1997, Kohala Coast, Hawaii, 957-962.
Shows how MRA techniques were applied in the DARPA-sponsored
Includes PWA and PWB thermomechanical analyses driven by
STEP AP210 product models that originated in the Mentor Graphics
BoardStation layout tool.
Peak, R. S.; Fulton, R. E. (1993b)
Automating Routine Analysis in Electronic Packaging Using Product
Model-Based Analytical Models (PBAMs), Part II: Solder Joint Fatigue
Paper 93-WA/EEP-24, ASME Winter Annual Meeting, New Orleans.
Condensed version of solder joint analysis case studies in [Peak,
1993]. Illustrates automated routine analysis, mixed formula-based
and FEA-based analysis models, multidirectional analysis, and
capabilities of constraint schematic notation.
The Multi-Representation Architecture (MRA) Technique
Wilson MW, Peak RS, Fulton RE (2001)
Enhancing Engineering Design and Analysis Interoperability - Part 1: Constrained Objects,
First MIT Conference Computational Fluid and Structural Mechanics (CFSM), Boston. Received Young Researcher Fellowship award.
Peak RS and Wilson MW (2001)
Enhancing Engineering Design and Analysis Interoperability
Part 2: A High Diversity Example,
First MIT Conference Computational Fluid and Structural Mechanics (CFSM), Boston.
- Peak, R.S.; Scholand, A.J.; Tamburini, D.R.; Fulton, R.E. (1999) Towards the Ubiquitization of Engineering Analysis to Support Product Design
, Invited Paper for Special Issue: Advanced Product Data Management Supporting Product Life-Cycle Activities, Intl. J. Computer Applications in Technology, Vol. 12, No. 1, 1-15.
Overviews the ubiquitization methodology for creating highly automated
product data-driven analysis modules that can be implemented in the MRA.
Peak, R.S.; Fulton, R.E.; Nishigaki, I.; Okamoto, N. (1998) Integrating Engineering Design and
Analysis Using a Multi-Representation Approach , Engineering with Computers,
Volume 14, Number 2., 93-114.
Introduces the multi-representation architecture (MRA) which places
product models (PMs), PBAMs, ABBs, and solution method models
(SMMs) in a broader, interdependent context. Presents the explicit
representation of design-analysis associativity, and proposes
a routine analysis automation methodology.
Peak, R. S. (1993)
Product Model-Based Analytical Models (PBAMs): A New Representation of
Engineering Analysis Models.
Doctoral Thesis, Georgia Institute of Technology, Atlanta.
Focuses on the PBAM representation (including the ABB representation
and constraint schematics) and automation of routine analysis.
Includes example applications to solder joint analysis, and defines
objectives for analysis model representations. Contains a starter set
of ABBs. Discusses PMs and a precursor to SMMs, but does not
explicitly define the MRA itself.
Analyzable Product Model (APM) Technique
Tamburini, D. R. (1999)
The Analyzable Product Model Representation to Support Design-Analysis Integration. Doctoral Thesis, Georgia Institute of Technology, Atlanta.
Defines the analyzable product model (APM) technique that facilitates design-analysis integration. This representation defines formal, generic, computer-interpretable constructs to create and manipulate analysis-oriented views of engineering products. Capabilities include merging design information from multiple sources and adding idealization knowledge for usage by diverse simulation templates.
Tamburini, D. R.; Peak, R. S.; Fulton, R. E. (1997)
PWA Thermomechanical Analysis from STEP AP210 Product Models. 1997
ASME Intl. Mech. Engr. Congress & Expo., Dallas.
Tamburini, D. R.; Peak, R. S.; Fulton, R. E. (1996)
Product Data for Engineering Analysis with Applications to Printed
Wiring Assemblies. Application of CAE/CAD to Electronic Systems,
EEP-Vol.18, Agonafer, D., et al., eds., 1996 ASME Intl. Mech.
Engr.Congress & Expo., Atlanta, 33-46.
Introduces the analyzable product model (APM) as a refined type of product model
(PM) aimed specifically at supporting analysis. Describes how to populate APMs
from design tool data via STEP.
Parametric, Modular Finite Element Modeling
Zeng S., Peak R., Matsuki R., Xiao A., Wilson M., Fulton R. E. (2003),
An Information-Driven FEA Model Generation Approach for Chip Package Applications, ASME CIE Conf., Chicago.
Describes technique for representing analysis model knowledge to enable automated meshing of highly coupled variable topology multi-body (VTMB) models.
Zhou, Wen X. (1997),
Modularized & Parametric
Modeling Methodology for Concurrent Mechanical Design of Electronic
Packaging , Doctoral Thesis, Georgia Institute of Technology, Atlanta.
Defines technique for taking advantage of product-specific knowledge to create
complex finite element models that are not practical with typical
Zhou, W. X.; Hsiung, C. H.; Fulton, R. E.; Yin, X. F.;
Yeh, C. P.; Wyatt, K. (1997)
CAD-Based Analysis Tools for Electronic Packaging Design
(A New Modeling Methodology for a Virtual Development Environment).
InterPACK'97, Kohala Coast, Hawaii.
Overview of [Zhou, 1997] as well as interactive finite element models.