Session: Innovations in CAD/CAE Integration in Electronic Packaging - I

1. Challenges in ECAD Tool Integration for Digital and RF Packages

Madhavan Swaminathan
Packaging Research Center, Georgia Tech, Atlanta
(Invited Review Presentation with Extended Abstract)

2. Integrating Reliability Analysis Tools in CAD/CAE

Yizhak Bot
BQR Reliability Engineering Ltd., Israel

3. A Framework for Integration of Analysis Tools for Microelectronic Devices

Ian R. Grosse
Department of Mechanical and Industrial Engineering
University of Massachusetts, Amherst, MA

Daniel H. Schaubert, T. Chio
Department of Electrical and Computer Engineering
University of Massachusetts, Amherst, MA

Daniel D. Corkill
Blackboard Technology Group, Inc., Amherst, MA

Mark Stoklosa
Rome Laboratory, Rome, NY

4. Models of Electronic Package Engineering

Fred L. Cox, III
Georgia Tech Research Institute, Atlanta

Gintautas B. Jazbutis
Structural Dynamics Research Corporation, Seattle

5. Integrated Durability Design Tool for Electronic Packaging

Mostafa Rassaian, J.C. Lee, and D.W. Twigg
Defense & Space Group, The Boeing Co., Seattle

6. SOLIDIS: A TCAD Environment for Packaging Simulation

Jorg M. Funk*, Lars H. Bomholt*, Renzo P. Paganini**, Hans-Petter Lien*, and Wolfgang Fichtner**

* ISE AG, Technopark Zurich, Zurich, Switzerland

** Institute for Integrated Systems, ETH Zurich, Switzerland

Session: Innovations in CAD/CAE Integration in Electronic Packaging - II

1. CAD/E Requirements and Usage for Reliability Assessment of Electronic Products

Michael Osterman
CALCE EPRC, University of Maryland, College Park, MD

Tom Stadterman and Randy Wheeler
US Army Material Systems Analysis Activity, Aberdeen Proving Grounds, MD

2. An Integrated Software Product for the Thermomechanical Analysis of Electronic Chips

S. Kjellberg and D. McGuckin
Pacific Engineering Systems International, Austrailia

L. T. Kisielewicz and K. Ando
Nihon Engineering Systems International, Japan

K. Saijo
Nissho Iwai Mechatronics, Japan

3. Thermomechanical CAD/CAE Integration in the TIGER PWA Toolset

Russell S. Peak
Engineering Information Systems Laboratory, Georgia Tech, Atlanta

Robert E. Fulton and Suresh K. Sitaraman
School of Mechanical Engineering, Georgia Tech, Atlanta

4. Employing Computer-Aided Design Tools for Reliable Die Attachment

Thomas J. Stadterman, Rhonda Anderson, William F. Braerman, and Michael W. Deckert
US Army Material Systems Analysis Activity, Aberdeen Proving Ground, MD

5. CAD-Based Analysis Tools for Electronic Packaging Design
(A New Modeling Methodology for a Virtual Development Environment)

Wen X. Zhou, Chien H. Hsiung, Robert E. Fulton
School of Mechanical Engineering, Georgia Tech, Atlanta

Xun Fei Yin
Hydropower Planning and Design General Institute, Beijing, China

Chao-Pin Yeh and Karl Wyatt
Corporate Software Development & Simulation, Motorola, Inc., Schaumberg, IL