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Analysis Theory & Methodology Research

analysis theory and methodology (ATM) - the study of the engineering analysis process and how to improve it

Research Areas

  • Design-analysis integration (DAI), including product data-driven analysis using open standards like STEP
  • Product-specific manufacturing process optimization
  • X-Analysis Integration (XAI): X = Manufacturing, Maintenance, Refurbishment, Forensic Investigation, etc.
  • Engineering service bureaus (ESBs) - Inter/Intra-net based organizations for delivery of highly automated self-service analysis

Core Project

This ongoing EIS Lab project provides the common research and development base for many of our ATM and DAI-related projects. General cross-project techniques and tools in the above Research Areas are developed here in a synergistic manner. Through this mechanism we can leverage resources to provide greater benefits for both small and large collaborative efforts.

For more information on becoming a part of this Project, please contact Russell Peak.

Case Study Program

We believe to improve the analysis process, one must do the analysis process - analysis on real problems under real circumstances. Thus we have instituted a Case Study Program whereby industrial clients can have us conduct analyses on their particular problems. While providing accurate results and advice is the aim of each case study individually, the primary collective goal is a better understanding of the engineering analysis process. In addition to conducting the normal analysis process for a given case study, we record aspects that are noteworthy with respect to ATM research. At the conclusion of a case study, we summarize our observations in an ATM case log.

We have found this arrangement advantageous to both industry (as it helps solve their problems) and to our research (as it highlights gaps and sparks creative solutions, tempered by industrial realities).

Recent case studies include:

  • Thermal analysis of a multi-chip module (MCM)
  • Structural analysis of vinyl sheet pilings
  • Thermal behavior of power supplies

If your company has analysis needs that you would us to address under this program, please contact Russell Peak.